38 English-speaking jobs in Aachen

Sales Associate responsible for providing excellent customer service and achieving store goals. Requires strong communication, product interest, and an independent working style.

Warehouse Assistant role for graduates. This position involves full-time or part-time shifts, working Monday to Saturday. No prior logistics experience is required.

Warehouse Worker position available for immediate hiring. This role involves full-time or part-time shifts, including early, late, and night schedules, working Monday to Saturday.

Warehouse Logistics Associate role involving full-time or part-time shifts. The position requires working Monday to Saturday.

Design and develop firmware and software for wireless modules like Wi-Fi, Bluetooth, and LTE/5G. Responsibilities include driver development for Embedded Linux/Android and RF hardware bring-up. Requires C/C++ skills and experience in embedded systems.

Oversee ASIC program development for electronics and photonics in chiplet packages. Lead cross-functional teams, manage schedules, and coordinate external IP providers to meet technical and quality targets.

Senior Accountant leads financial accounting, managing asset accounting, AP, and the general ledger. Responsibilities include preparing monthly, quarterly, and annual financial statements while collaborating with auditors and tax advisors.

Own the hardware architecture of a next-generation hybrid compute engine combining electronic and photonic technologies. Define compute architecture, memory hierarchy, and system interfaces for dynamic workload execution.

System Administrator specializing in Linux and open-source software. Responsibilities include system administration, expansion, and optimization of Linux (laptops/servers) and Kubernetes platforms, plus troubleshooting and Jira support.

Experienced Engineer to own the complete tape-out flow for Electronic-Photonics ICs. Responsibilities include GDS integration, mask data preparation, and driving DfX co-integration on a 300mm platform. Requires 5+ years in semiconductor tape-out and MDP.

Execute product qualification activities, turning plans into test setups and traceable evidence for product release. Develop test hardware, run bench/lab tests (thermal, electrical, etc.), and coordinate campaigns with external partners.

Lead tool installation and reliability planning for wet cleaning in a cleanroom facility. Advance wet cleaning capabilities, guide tool evaluation, and oversee installation, start-up, and qualification of cleaning tools.

Senior Wet Cleaning Process Development Engineer to lead wet clean process development and scaling for 2D materials in a new semiconductor fab. Responsibilities include tool validation, process definition, and maintaining Process of Record.

Senior High-Speed Analog/RF System Architect to own SerDes architecture for CMOS SoCs powering graphene photonic interconnect technology. Define electrical architecture, drive system-level trade-offs, and translate customer requirements into scalable solutions.

Design, simulate, and validate high-speed analog transmitter and receiver circuits for next-generation Optical Compute Interconnect products. Develop power-efficient analog front ends interfacing with integrated photonic devices.

Associate Consultant performs cost analyses of technical products and components, supporting early-stage development and target costing. The role involves identifying cost-reduction opportunities and presenting results to clients.

Senior Electrical Engineer responsible for electrical design in product and platform development. Duties include circuit design, PCB layout coordination, and troubleshooting. Requires 2-5 years of experience in electrical engineering product development.

Lead Plating Process Engineer for next-gen materials like graphene. Oversee fab startup, tool qualification, and process ramp-up. Requires 5+ years in semiconductor plating process engineering.

Senior Equipment Engineer to lead tool planning and installation for Black FabONE. Responsibilities include equipment selection, vendor management, and process qualification for electrochemical plating in semiconductor manufacturing.

Own packaged product reliability, defining mission profiles and failure mechanisms. Assess risks across substrates, interconnect, and solder joints. Lead qualification plans and failure analysis to drive data-driven release recommendations.